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XC7Z035-L2FFG676I
赛灵思(XILINX)
封装规格:FCBGA-676 DMA(直接存储器存取):有 工作温度范围:-40℃~+100℃ SDIO:有 RAM总容量:256KB USB通用接口:有 通信协议:以太网协议 外设/功能:DMA；片内可编程逻辑器件；以太网协议栈；SDIO CPU最大主频:800MHz CPU内核:ARM-A系列
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mallbom
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mallbom
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XC7Z035-L2FFG676I
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In Stock Immediately
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mlccbase
Shenzhen Mlccbase Electronics Technology Co., Ltd
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XC7Z035-L2FFG676I
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leacores
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AVAILABLE
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52314
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31173
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24109
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XC7Z035-L2FFG676I
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Dual ARM脗庐 Cortex脗庐-A9 MPCore芒聞垄 with CoreSight芒聞垄 System On Chip (SOC) IC Zynq脗庐-7000 Kintex芒聞垄-7 FPGA, 275K Logic Cells 800MHz 676-FCBGA (27x27)
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